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? 2003 microchip technology inc. ds21391c-page 1 m TC1412/TC1412n features ? latch-up protected: will withstand 500 ma reverse current ? input will withstand negative inputs up to 5v ? esd protected: 4 kv ? high peak output current: 2a ? wide input supply voltage operating range: - 4.5v to 16v ? high capacitive load drive capability: - 1000 pf in 18 nsec ? short delay time: 35 nsec typ. ? matched delay times ? low supply current: - with logic ? 1 ? input: 500 a - with logic ? 0 ? input: 100 a ? low output impedance: 4 ? ? available in space-saving 8-pin msop package ? pinout same as tc1410/tc1411/tc1413 applications ? switch mode power supplies ? pulse transformer drive ? line drivers ? relay driver package type general description the TC1412/TC1412n are 2a cmos buffers/drivers. they will not latch-up under any conditions within their power and voltage ratings. they are not subject to damage when up to 5v of noise spiking of either polarity occurs on the ground pin. they can accept, without damage or logic upset, up to 500 ma of current of either polarity being forced back into their output. all terminals are fully protected against up to 4 kv of electrostatic discharge. as mosfet drivers, the TC1412/TC1412n can easily charge a 1000 pf gate capacitance in 18 nsec with matched rise and fall times, and provide low enough impedance in both the on and the off states to ensure the mosfet?s intended state will not be affected, even by large transients. the leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. 2 6,7 inverting 8-pin msop/pdip/soic 1 2 3 4 v dd 5 6 7 8 out gnd v dd in nc gnd out TC1412 nc = no internal connection 2 6,7 non-inverting 1 2 3 45 6 7 8 TC1412n v dd in nc gnd v dd out gnd out note: duplicate pins must be connected together for proper operation. 2a high-speed mosfet drivers
TC1412/TC1412n ds21391c-page 2 ? 2003 microchip technology inc. functional block diagram effective input c = 10 pf TC1412n output input gnd v dd 300 mv 4.7v inverting non-inverting outputs outputs TC1412
? 2003 microchip technology inc. ds21391c-page 3 TC1412/TC1412n 1.0 electrical characteristics absolute maximum ratings ? supply voltage .....................................................+20v input voltage ...................... v dd + 0.3v to gnd ? 5.0v power dissipation (t a 70c) msop .......................................................... 340 mw pdip ............................................................ 730 mw soic............................................................ 470 mw storage temperature range.............. -65c to +150c maximum junction temperature ...................... +150oc ? stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. pin function table symbol description v dd supply input, 4.5v to 16v input control input nc no connection gnd ground gnd ground output cmos push-pull output, common to pin 7 output cmos push-pull output, common to pin 6 v dd supply input, 4.5v to 16v dc electrical characteristics electrical specifications: unless otherwise noted, over operating temperature range with 4.5v v dd 16v. typical values are measured at t a = +25c, v dd = 16v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.0 ? ? v logic ? 0 ?, low input voltage v il ??0.8v input current i in -1.0 ? 1.0 a 0v v in v dd, t a = +25c -10 ? 10 -40c t a +85c output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance r o ?46 ? v dd = 16v, i o = 10 ma, t a = +25c ?57 0c t a +70c ? 5 7 -40c t a +85c peak output current i pk ?2.0?av dd = 16v latch-up protection withstand reverse current i rev ? 0.5 ? a duty cycle 2%, t 300 sec, v dd = 16v switching time (note 1) rise time t r ?1826nsect a = +25c ?2031 0c t a +70c ? 22 31 -40c t a +85c, figure 4-1 fall time t f ?1826nsect a = +25c ?2031 0c t a +70c ? 22 31 -40c t a +85c, figure 4-1 note 1: switching times ensured by design.
TC1412/TC1412n ds21391c-page 4 ? 2003 microchip technology inc. temperature characteristics delay time t d1 ?3545nsect a = +25c, ?4050 0c t a +70c ? 40 50 -40c t a +85c, figure 4-1 delay time t d2 ?3545nsect a = +25c ?4050 0c t a +70c ? 40 50 -40c t a +85c, figure 4-1 power supply power supply current i s ?0.51.0mav in = 3v, v dd = 16v ? 0.1 0.15 v in = 0v electrical specifications: unless otherwise noted, all parameters apply with 4.5v v dd 18v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0?+70oc specified temperature range (e) t a -40 ? +85 oc maximum junction temperature t j ??+150oc storage temperature range t a -65 ? +150 oc package thermal resistances thermal resistance, 8l-msop ja ? 206 ? oc/w thermal resistance, 8l-pdip ja ? 125 ? oc/w thermal resistance, 8l-soic ja ? 155 ? oc/w dc electrical characteristics (continued) electrical specifications: unless otherwise noted, over operating temperature range with 4.5v v dd 16v. typical values are measured at t a = +25c, v dd = 16v. parameters sym min typ max units conditions note 1: switching times ensured by design.
? 2003 microchip technology inc. ds21391c-page 5 TC1412/TC1412n 2.0 typical performance curves note: unless otherwise indicated, over operating temperature range with 4.5v v dd 16v. figure 2-1: quiescent supply current vs. supply voltage. figure 2-2: input threshold vs. supply voltage. figure 2-3: high-state output resistance vs. supply voltage. figure 2-4: quiescent supply current vs. temperature. figure 2-5: input threshold vs. temperature. figure 2-6: low-state output resistance vs. supply voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0 100 200 300 400 500 16 14 12 10 8 6 4 v in = 3v v in = 0v t a = +25 c i supply ( a) v dd (v) v dd (v) v threshold (v) 1.1 1.2 1.3 1.4 1.5 1.6 16 14 12 10 8 6 4 v ih v il t a = +25 c v dd (v) 1 3 5 7 9 11 13 16 14 12 10 8 6 4 t a = - 4 0 c t a = + 2 5 c t a = + 8 5 c r ds-on (ohms) -40-20 0 20406080 0 100 200 300 400 500 i supply ( a) v in = 3v v in = 0v v supply = 16v temperature ( c) -40 -20 0 20 40 60 80 1.1 1.2 1.3 1.4 1.5 1.6 v supply = 16v temperature ( c) v threshold (v) v ih v il v dd (v) 1 3 5 7 9 11 13 16 14 12 10 8 6 4 t a = - 4 0 c t a = + 2 5 c t a = + 8 5 c r ds-on (ohms)
TC1412/TC1412n ds21391c-page 6 ? 2003 microchip technology inc. note: unless otherwise indicated, over operating temperature range with 4.5v v dd 16v. figure 2-7: rise time vs. supply voltage. figure 2-8: propagation delay vs. supply voltage. figure 2-9: rise and fall times vs. capacitive load. figure 2-10: fall time vs. supply voltage. figure 2-11: propagation delay vs. supply voltage. figure 2-12: propagation delays vs. capacitive load. v dd (v) t rise (nsec) 10 20 30 40 50 60 70 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c c load = 100 0 pf v dd (v) t d1 (nsec) 20 30 40 50 60 70 80 90 100 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c c load = 100 0 pf t rise , t fall (nsec) c load (pf) 0 1000 2000 3000 4000 5000 0 10 20 30 40 50 60 t fall t rise t a = +25 c v dd = 16v t fall (nsec) 10 20 30 40 50 60 70 16 14 12 10 8 6 4 t a = +85 c t a = -40 c t a = +25 c c load = 100 0 pf v dd (v) v dd (v) 20 30 40 50 60 70 80 90 100 16 14 12 10 8 6 4 c load = 100 0 pf t a = -40 c t a = +25 c t a = +85 c t d2 (nsec) c load (pf) propagation delays (nsec) 0 1000 2000 3000 4000 5000 32 33 34 35 36 37 38 39 t d2 t d1 t a = +25 c v dd = 16v
? 2003 microchip technology inc. ds21391c-page 7 TC1412/TC1412n 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 supply input (v dd ) the v dd input is the bias supply for the mosfet driver and is rated for 4.5v to 16v with respect to the ground pin. the v dd input should be bypassed to ground with a local ceramic capacitor. the value of the capacitor should be chosen based on the capacitive load that is being driven. a value of 1.0 f is suggested. 3.2 control input (input) the mosfet driver input is a high-impedance, ttl/cmos-compatible input. the input has 300 mv of hysteresis between the high and low thresholds which prevents output glitching even when the rise and fall time of the input signal is very slow. 3.3 cmos push-pull output (output) the mosfet driver output is a low-impedance, cmos push-pull style output, capable of driving a capacitive load with 2a peak currents. 3.4 ground (gnd) the ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. the ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 3.5 no connect (nc) no internal connection. pin no. symbol description 1v dd supply input, 4.5v to 16v 2 input control input 3 nc no connection 4 gnd ground 5 gnd ground 6 output cmos push-pull output, common to pin 7 7 output cmos push-pull output, common to pin 6 8v dd supply input, 4.5v to 16v
TC1412/TC1412n ds21391c-page 8 ? 2003 microchip technology inc. 4.0 application information figure 4-1: switching time test circuit. c l = 1000 pf 0.1 f 1.0 f inverting driver non-inverting driver input v dd = 16v input output t d1 t f t r t d2 input: 100 khz, square wave, t rise = t fall 10 nsec output input output t d1 t f t r t d2 +5v 10% 90% 10% 90% 10% 90% v dd 0v 90% 10% 10% 10% 90% +5v v dd 0v 0v 0v 90% 4, 5 2 6, 7 1, 8 TC1412 TC1412n TC1412n TC1412
? 2003 microchip technology inc. ds21391c-page 9 TC1412/TC1412n 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard marking consists of microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). for marking beyond this, certain price adders apply. please check with your microchip sales office. TC1412 cpa057 0347 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn TC1412 coa0347 057 8-lead msop example: xxxxxxx ywwnnn 1412ne 347057
TC1412/TC1412n ds21391c-page 10 ? 2003 microchip technology inc. 8-lead plastic dual in-line (pa) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51015 51015 mold draft angle bottom 51015 51015 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
? 2003 microchip technology inc. ds21391c-page 11 TC1412/TC1412n 8-lead plastic small outline (oa) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
TC1412/TC1412n ds21391c-page 12 ? 2003 microchip technology inc. 8-lead plastic micro small outline package (ua) (msop) d a a1 l c (f) a2 e1 e p b n 1 2 dimensions d and e 1 do not include mold flash or protrusions. mold flash or protrusions shall not .037 r e f f footprint (r eference) exceed .010" (0.254mm) per side. notes: drawin g no. c04-111 *c ontrolling p a ra me te r mold draft angle top mold d ra ft a ngle b ottom f oot angle lead width lead thickness c b .003 .009 .006 .012 dimension limits o verall height molded package thickness molded package width overall length f oot length standoff overall width number of pins pitch a l e1 d a1 e a2 .016 .024 .118 bs c .118 bs c .000 .030 .193 bs c .033 min p n units .026 bs c nom 8 inc he s 0.95 r e f - - .009 .016 0.08 0.22 0? 0.23 0.40 8? millimeters* 0.65 bs c 0.85 3.00 bs c 3.00 bs c 0.60 4.90 bs c .043 .031 .037 .006 0.40 0.00 0.75 min max nom 1.10 0.80 0.15 0.95 max 8 -- - 15? 5? - 15? 5? - jedec equivalent: mo-187 0? - 8? 5? 5? - - 15? 15? - - - -
? 2003 microchip technology inc. ds21391c-page 13 TC1412/TC1412n product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . sales and support device: TC1412: 2 a single mosfet driver, inverting TC1412n: 2 a single mosfet driver, non-inverting temperature range: c = 0c to +70c e = -40c to +85c package: oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead (tape and reel) ua = plastic micro small outline (msop), 8-lead * ua713 = plastic micro small outline (msop), 8-lead * (tape and reel) pa = plastic dip (300 mil body), 8-lead * msop package is only available in e-temp. part no. x /xx package temperature range device examples: a) TC1412coa: 2a single mosfet driver, soic package, 0c to +70c. b) TC1412cpa: 2a single mosfet driver, pdip package, 0c to +70c. c) TC1412eua713: tape and reel, 2a single mosfet driver, msop package, -40c to +85c. a) TC1412ncpa: 2a single mosfet driver, pdip package, 0c to +70c. b) TC1412nepa: 2a single mosfet driver, pdip package, -40c to +85c. c) TC1412neua: 2a single mosfet driver, msop package, -40c to +85c. data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1412/TC1412n ds21391c-page 14 ? 2003 microchip technology inc. notes:
? 2003 microchip technology inc. ds21391c-page 15 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, k ee l oq , mplab, pic, picmicro, picstart, pro mate and powersmart are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, micro id , mxdev, mxlab, picmaster, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. accuron, application maestro, dspic, dspicdem, dspicdem.net, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, microport, migratable memory, mpasm, mplib, mplink, mpsim, picc, pickit, picdem, picdem.net, powercal, powerinfo, powermate, powertool, rflab, rfpic, select mode, smartsensor, smartshunt, smarttel and total endurance are trademarks of microchip technology incorporated in the u.s.a. and other countries. serialized quick turn programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2003, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification contained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specifications contained in microchip's data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999 and mountain view, california in march 2002. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, non-volatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001 certified.
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